Tech Lobby

London, July 2008 - June 27th saw a wide range of high-profile artists such as Annie Lennox, Leona Lewis, the Sugababes and Will Smith assemble in London’s Hyde Park for a concert to mark the 90th birthday of the former president of South Africa — and global icon — Nelson Mandela. And with Sennheiser on hand to continue its tradition of supplying microphones, wireless monitoring and full technical support, both the artists and the huge audience were assured of enjoying every vocal nuance.

Organised by 46664, Nelson Mandela’s global HIV AIDS awareness campaign, the concert was a celebration of Mr Mandela’s 90th year and marked the 20th anniversary of the Free Nelson Mandela concert staged at Wembley in 1988. The concert also raised funds for his 46664 campaign to fight HIV and AIDS worldwide. This was the fifth 46664 concert that Sennheiser has supported, continuing a long standing relationship with the charity.

Working in association with the event’s audio production company, Britannia Row, Sennheiser not only supplied equipment but also a high-profile technical team to the event, including Mark Saunders (Global Relations), Dave Hawker (UK Technical Director) and Sam Davison (UK Service Manager).

Sennheiser equipment supplied throughout the event included ew 300 G2 wireless monitoring systems, SKM 5200/EM 3532 radio microphone and receiver systems, SKM 935/EM 550 radio mic and receiver systems, evolution series wired microphones and Neumann wired microphones.

With such a large event and range of artists, working out the radio frequencies for both vocal mics and monitoring was a potential minefield. However, Sennheiser’s experience at these events, and its close working relationship with Britannia Row, ensured that no problems occurred.

“Having worked alongside Britannia Row on previous large-scale events such as Live 8, Live Earth and the previous four Mandela 46664 concerts, we employed a tried and tested set-up,” says Dave Hawker. “This allowed a seamless RF system that covered all the potential problems encountered with a large stage area, combined with an ever changing bill of artists.”

“The event also allowed a co-ordinated working partnership between Sennheiser, Britannia Row and radio licensing company JFMG, who allowed greater control over parts of the radio spectrum, meaning that the event frequency planning was easier to calculate and manage.”

Several regular Sennheiser users performed at the show, including Annie Lennox, Leona Lewis and the Sugababes. All of the ‘visiting’ vocalists who performed with the show’s house band — including Amy Winehouse and Jamelia — used either e 935 wired or SKM 935 wireless vocal microphones.

A number of top performers, including Annie Lennox, Leona Lewis, Will Smith, Geri Halliwell and various presenters, used Sennheiser’s latest radio transmitter, the SKM 5200, which combines the best elements of the SKM 5000 N, including use of the Neumann KK 105 S capsule, with redesigned mechanics, electronics and user interface to fulfil the most demanding requirements of prestigious live events.

“For a singer of Leona’s style, the SKM 5200 provides the perfect balance. The mic captures ever nuance of her voice and the radio system transmits it perfectly without losing anything,” says Lewis’s front-of-house engineer Dave Wooster. “I really like Sennheiser’s mics. The Neumann capsule is the most forgiving with ambient noise, it really makes a difference because the signal I am dealing with at FOH sounds exactly as it should. It’s like being in a studio — you hear everything that she does.”

“For me there is no better option on the market. From her voice through the capsule, through the conversion and back again, it’s the best. I have carte blanche to use whatever I want for Leona’s vocal mic and the SKM 5200 is what I choose.”

About Sennheiser
The Sennheiser Group, with its headquarters in Wedemark near Hanover, Germany, is one of the world’s leading manufacturers of microphones, headphones and wireless transmission systems. The family-owned company, which was established in 1945, recorded sales of over €395 million in 2007, 83% of which were generated abroad. Sennheiser employs almost 2,000 people worldwide, around 55% of whom are in Germany. Sennheiser has manufacturing plants in Germany, Ireland and the USA and is represented worldwide by subsidiaries in France, Great Britain, Belgium, the Netherlands, Germany, Denmark (Nordic), Russia, Hong Kong, India, Singapore, Japan, China, Canada, Mexico and the USA, as well as by long-term trading partners in many other countries. Also part of the Sennheiser Group are Georg Neumann GmbH, Berlin (studio microphones), K + H Vertriebs- und Entwicklungsgesellschaft mbH (Klein + Hummel studio monitors, installed sound) and the joint venture Sennheiser Communications A/S (headsets for PCs, offices and call centres).

Antec, the leading global brand of high-performance computer components for the PC upgrade and Do-It-Yourself markets, has launched the Signature Series, its newest and most advanced family of power supply units.

Available in 850 Watts and 650 Watts, the Signature Series features cutting-edge innovations that set it above the competition, several of which have never been offered in a consumer power supply. The Signature Series uses active DC-to-DC voltage regulation as opposed to the standard passive magnetic amplifier method, which provides for shorter transient response times and greater system stability. The Signature Series’ transient response times can be as low as 10 microseconds, in contrast to the standard power supply transient times of 1000 microseconds (1 millisecond). In addition, the Signature Series has an advanced cooling system with a Pulse Width Modulation (PWM) fan. By adapting its speed to the power output of the unit, a PWM controlled fan can run at speeds as low as 15% of its maximum, as opposed to a traditional fan that can only run at about 40%, thus ensuring the quietest possible operation.

All Signature Series power supply units are built to the highest standards of quality, using exceptionally reliable components such as Japanese capacitors and fans. The Signature Series also includes a dual power circuit board (PCB) layout to optimise airflow, as well as to allow for heavier and more robust components and reduce electrical noise. Each Signature Series power supply unit boasts a hybrid advanced cable management system to provide optimal power distribution and airflow. Mandatory cables are hardwired to reduce resistance and energy waste, while the peripheral cables can be installed as needed, which reduces clutter. Signature Series power supplies pass 80 PLUS®, the highest independently-certified standard in energy efficiency, reducing operating costs and protecting the environment. The Signature Series has also received the 80 PLUS Bronze distinction for maintaining 82% efficiency at 20% and 100% of rated load and 85% efficiency at 50% of rated load. This is a truly exceptional distinction, shared by very few commercial power supplies.

“The Signature Series is a truly premium product,” said Scott Richards, senior vice president at Antec. “The response capabilities, cooling system and hybrid advanced cable management are perfect for discerning builders looking for the very best. We believe the Signature Series will set bold new standards for quietness and stability.”

The Signature 650 and Signature 850 will soon be available. Signature Series is available through major retailers, e-tailors and distributors. The PSUs are backed by Antec’s Quality 5-Year Warranty for parts and labour. For additional product information and full technical specifications please visit www.antec.com

About Antec, Inc.
Antec, Inc., is the leading global brand of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself (DIY) markets. Founded in 1986, Antec is recognised as a pioneer in these industries and has maintained its position as a worldwide market leader and international provider of efficient, quiet, and reliable products. Antec has also achieved great success in the distribution channel, meeting the demands of quality-conscious system builders, VARs and integrators.

Antec’s offering of enclosures includes a large range of cases, such as its technically advanced Performance One Series, cost-effective New Solution Series and server grade cases designed for the needs of all workstation and server markets. Antec’s products also include front line power supplies such as its TruePower Quattro series, NeoPower series, and EarthWatts, the most environmentally friendly power supply available. PC gamers are an increasingly significant consumer of performance components, and many Antec products are geared toward the gaming demographic, like the Nine Hundred, the premier gamer enclosure. Antec also offers a computing accessories line comprised of many original products, including its patented LED Fans and Notebook Cooling solutions.

Antec is based in Fremont, California, with additional offices in Rotterdam, The Netherlands. The company’s products are sold in more than 30 countries throughout the world. Please visit www.antec.com for more information.

Sunnyvale, CA—February 7, 2008—OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the OCZ PC2-8500 Reaper HPC 4GB, one the fastest high density kits in the world. Incorporating all the features that make the Reaper HPC series the top choice among gamers and overclockers, this ultra high-speed DDR2 is designed to meet the growing demand for faster high density memory for both productivity and gaming applications. With the price of top-speed DDR2 more affordable to a wide range of consumers, the Reaper HPC 4GB kits offer incredible performance at an attractive price.

“DDR2 is starting to adopt 1066 MHz as the new mainstream frequency, not only for extreme overclocking but also for high system memory densities,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “In order to maximize the system performance, especially in the latest games, 4GB of memory are more and more becoming a must have…but it is also necessary to maintain the throughput regardless of the increase in density. The new PC2-8500 Reaper HPC 4GB kits combine the best of two worlds by delivering extreme bandwidth at 1066 MHz data frequency at 5-5-5 latencies, in combination with advanced heatpipe-based thermal management to again raise the bar for high system memory densities.”

The latest PC titles that make use of DirectX 10 crave more than the standard 2GB of RAM for the ultimate gameplay experience and the highest settings. Computer enthusiasts and professionals utilizing high-bandwidth video, music, and graphics applications will also benefit from the ultimate balance of speed and density the new PC2-8500 4GB Reaper HPC offers.

To ensure superior stability and performance over the entire life of the memory the Reaper HPC Series makes use of an innovative cooling solution to more effectively dissipate heat produced by high-speed memory. The thermo-conductive copper heat pipe conduit is ideal for overclocking where every degree matters. Featuring the new all- black PCB, the Reaper HPC 4GB edition is a stylish upgrade for case-modders and system builders.

The new modules also offer instant overclocking right out of the box with EPP (Enhanced Performance Profiles) programmed into the SPD. PC2-8500 Reaper modules will immediately boot at the rated specs on the latest generation of NVIDIA® SLI™ chipsets. Although seasoned enthusiasts will get the most performance benefits from tweaking the memory settings, EPP eliminates the need for manual configuration and makes the benefits of overclocking available to the complete range of consumers looking to get the most out of their systems.

The PC2-8500 Reaper HPC Series will be available in 4GB (2×2048MB) Dual Channel Kits, and are rated at a blazing 1066MHz at CL 5-5-5. Although the OCZ Reaper HPC series can meet all enthusiast demands, this high-capacity, high performance memory can become a user-friendly household item for the complete range of consumers looking to maximize system performance with additional RAM. As part of OCZ’s line-up of premium memory, Reaper HPC PC2-8500 modules are backed by a Lifetime Warranty and industry-leading technical support so you can push your high-performance memory to its limit.

For more information on the OCZ PC2-8500 Reaper HPC 4GB Edition, please visit our product page here.

About OCZ Technology Group, Inc.
OCZ Technology Group, a member of JEDEC, designs, develops and manufactures ground-breaking, high performance memory and computer components that set industry standards. OCZ products are the first choice for users needing high-reliability, ultra-high performance solutions. In 2007, PC Power & Cooling and Hypersonic PC were brought into the OCZ Technology Group, forming a well-rounded, highly innovative organization that places the company at the forefront of high-end computing. All of OCZ Technology Group’s products are available through its worldwide network of distributors, online resellers and retail stores. For more information visit our website at www.ocztechnology.com.

~ Edimax to create anticipation and excitement to the end-user ~

Milton Keynes, United Kingdom, 6th January 2008 - Edimax Technology (TSEC: 3047), announced today a new look of its product packaging.

“With a commitment to innovation, quality management and enhancing customer satisfaction, we have implemented a new packaging initiative on our product boxes,” said Marketing Director Thomas Chu.

The new packaging features an artistic and a new corporate creative design on all products. In addition, there is increased product-box quality and better internal packaging with recyclable carton. Other features include the consolidation of the company’s eight current boxes down to three standard sizes. Edimax begin implementing the new packaging for all orders on 1st April.

“It is all about our customers and ensuring their confidence in our products,” said Chu. “Our new packaging shift has been an exciting transition for us. The designs capitalize on our quality, inside and out, and the new box sizes will allow simplicity and efficiency in our customer’s inventory.”

About Edimax:
Edimax Technology is a global manufacturer of a broad range of networking and connectivity solutions. Since its incorporation in 1986, the company has grown to be among Asia�s leading manufacturers of networking products and solutions. Edimax is headquartered in Taipei County, Taiwan, and is listed at the Taiwanese Stock Exchange since 2001. In 2006, the company�s revenue reached US $78 million and its current workforce counts over 750 employees worldwide. Edimax�s complete product portfolio fulfils all connectivity needs, whatever the network architecture or application requirements are, and consist of the following categories: Wireless, Connectivity, Routers, Switches, Print Servers, IP Cameras, Business Solutions and VoIP.

For more information about Edimax, please visit www.edimax.co.uk.

Vienna, February 6th 2008 - After the successful introduction of the NF-P12 120mm fan in November, Noctua presented today their first 92mm retail fan: The NF-B9 complements Noctua’s much acclaimed 80 and 120mm fan series, which have been recommended by over 150 international websites and magazines, and achieves outstanding airflow and pressure performance at exceptionally low noise levels.

“Many avid Noctua users have already asked us for a 92mm model”, explains Mag. Roland Mossig, Noctua CEO. “After a development period of over 18 months, we’re finally able to present a 92mm fan that fully meets our high demands and sets new standards in the 92mm range.”

The NF-B9’s highly-optimised blade design achieves an exceptional level of airflow and static pressure that most other fans can only reach at much higher speeds. For instance, the NF-B9 achieves no less than 64.3m³/h and 1.61mm H2O at 1600rpm.

Thanks to Noctua’s advanced noise reduction techniques however, the NF-B9 is surprisingly quiet at only 17.6dB(A): Bevelled blade tips and the Vortex-Control Notches - already known from the successful NF-P12 - minimize aerodynamic noise. Noctua’s well proven SSO-Bearing as well as the new SC drive system - already known from the NF-P12 - ensure outstanding quietness and long-term stability.

The NF-B9 has an MTBF of over 150.000 hours and comes with 6 years manufacturer’s warranty. Using the supplied Low-Noise and Ultra-Low-Noise adaptors, the fan’s speed can be reduced to 1300 resp. 1000 rpm thus achieving even greater quietness.

Price and availability
The NF-B9 is available immediately at a recommended price of EUR 17.90 / USD 21.90.

About Noctua:
Noctua comes from a cooperation between the Austrian Rascom Computerdistribution Ges.m.b.H and the Taiwanese Kolink International Corporation and has a development partnership with the Austrian Institute of Heat Transmission and Fan Technology (Österreichisches Institut für Wärmeübertragung und Ventilatorentechnik, ÖIWV). These connections form the key to the development of sound-optimised premium components “Designed in Austria”: The partnership with the ÖIWV permits the application of latest technology in methods of scientific measurement instrumentation, calculation and simulation in the R&D process. Rascom’s long, customer-orientated experience in developing and distributing sound-optimised high-end components ensures a clear focus on the users’ needs. The use of Kolink’s advanced manufacturing technology and ultra-modern production plants allows Noctua to efficiently implement its technical edge and provide solutions of the highest standard in quality and performance to the customer. www.noctua.com.

New architecture provides substantial increases in performance and functionality with leading power efficiency to enable next generation “Small is Beautiful” computing devices

Austin, Texas, US, 24 January 2008 – VIA Technologies, Inc, a leading innovator of x86 silicon and platform technologies, today announced details of the VIA Isaiah Architecture, a new x86 processor architecture that will deliver significant boosts to the functionality and performance of desktop, mobile and ultra mobile PCs while minimizing power requirements, saving on battery life and enabling ultra compact system designs.

Designed from the ground up by the company’s US-based processor design subsidiary, Centaur Technology Inc., the VIA Isaiah Architecture combines all the latest advances in x86 processor technology, including a 64-bit superscalar speculative out-of-order microarchitecture, high-performance multimedia computation, and a new virtual machine architecture. The first generation of Isaiah-based products will be pin-compatible with the VIA C7 processor family, enabling a smooth transition for system builders and providing them with an easy upgrade path for current designs.

The first processors implementing the VIA Isaiah Architecture will use proven 65 nanometer technology for greater power efficiency, which, combined with new enhanced power and thermal management capabilities, will ensure the best performance per watt on the market and help drive the rapidly emerging categories of green, silent and small form factor desktop PCs and home media centers, and ultra thin and light notebooks and mini-notes.

“Today is an exciting day for everyone at Centaur,” commented Glenn Henry, President, Centaur Technology Inc. “With a team of less than one hundred first-class engineers, we have created from scratch the world’s most power-efficient x86 processor architecture with state of the art features, outstanding performance, and flexible scalability for the future.”

“The introduction of the new VIA Isaiah Architecture is an extremely significant milestone in VIA’s processor business,” commented Wenchi Chen, President and CEO, VIA Technologies, Inc. “In achieving these new levels of functionality and performance, it provides the ideal complement to our industry-leading family of low power VIA C7 processors and will enable us to further extend our growing presence in the global x86 processor market.”

Optimized for a World of “Small is Beautiful” Devices
With its unique blend of high performance and low power consumption, the VIA Isaiah Architecture has been specifically optimized to meet the rapidly growing demand for smaller, more functional, and more stylish mobile and desktop computing and personal electronics devices that will allow people to fully enjoy the rich media content and interactivity of the broadband Internet lifestyle.

These devices range from easily portable slim and light notebooks and pocket-sized Ultra Mobile PCs and Ultra Mobile Devices with rich multimedia and wireless broadband capabilities to Small Form Factor Green PCs and Digital Entertainment Centers that combine space saving designs with minimal energy consumption.

VIA Isaiah Architecture Highlights
The VIA Isaiah Architecture has been specifically designed to deliver all the performance and features necessary for running the most demanding computing, entertainment, and connectivity applications on today’s and tomorrow’s Internet, including high-definition video, 3D games, imaging, and virtual worlds, within a very low power and thermal envelope that makes it ideal for small form factor mobile devices such as Mini-Notebooks and Ultra Mobile Devices. Its key highlights include the following:

– 64-bit Superscalar Speculative Out-Of-Order MicroArchitecture

The VIA Isaiah Architecture comprises a host of advanced architectural features, including a superscalar and out of order architecture, macro-fusion and micro-fusion functionality, and sophisticated branch prediction, that significantly improve processor efficiency and performance. In addition, it also features a full and unrestricted 64-bit instruction set with plenty of headroom to support 64-bit operating systems and applications as they become available, and a new virtual machine architecture for running systems more securely and efficiently in virtual environments.

– High-Performance Computation and Media Processing

As well as support for clock speeds of up to 2GHz in initial products and a high-speed, low power Front Side Bus scalable from 800MHz up to 1333MHz, the VIA Isaiah Architecture also has a highly-efficient cache subsystem with two 64KB L1 caches and 1MB exclusive L2 cache with 16-way associativity for more effective memory optimization.

For further enhanced multimedia performance, the VIA Isaiah Architecture also integrates the world’s fastest x86 processor Floating Point Unit (FPU) with the ability to execute four floating point adds and four multiplies per clock and also featuring a new algorithm that minimizes latency. Support for new SSE instructions and a 128-bit wide integer data path further boost multimedia performance.

– Advanced Power and Thermal Management

To minimize energy consumption and reduce heat, the VIA Isaiah Architecture utilizes new low power circuit techniques and in addition to aggressive management of active power includes support for the new “C6” power state, in which power is turned off to the caches.

Extensive Adaptive PowerSaver™ Technology features further reduce power consumption and improve thermal management, including the unique TwinTurbo™ dual-PLL implementation, which acts like automatic transmission in permitting smooth transitions between activity states within one clock cycle, ensuring always-on service and minimize latency, as well as new mechanisms for managing the die temperature.

– Scalable Upgrade to VIA C7™ Processor

The VIA Isaiah Architecture is pin-to-pin compatible with the current VIA C7 processor family, enabling OEMs and motherboard makers to transition to the new architecture smoothly, and to fulfill a wider range of market segments with a single board or system design.

– VIA PadLock™ Hardware Security Features

To enhance the confidentiality, integrity, and authenticity of electronic data, the VIA Isaiah Architecture incorporates industry-leading on-die hardware cryptographic acceleration features within the VIA PadLock Security Engine, including the world’s best random number generator (RNG), an AES Encryption Engine, SHA-1 and SHA-256 hashing for secure message digests for data integrity, and a new specialized “secure execution mode” that includes features such as a secure on-chip memory area and encrypted instruction fetching.

For more detailed information about the VIA Isaiah Architecture, please read the VIA Isaiah Architecture Brief written by Glenn Henry, President of Centaur Technology, here.

VIA Isaiah Architecture Product Availability
Processors implementing the VIA Isaiah Architecture are expected to start shipping in the first half of 2008 and will be manufactured using an advanced, low power 65 nanometer process.

About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw.

The VIA NAB 7500 is an industrial grade network appliance board for next generation network security appliances.

Taipei, Taiwan, 17 January 2008 - VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the VIA NAB 7500 embedded board for advanced network security solutions. Building on VIA’s strength in bringing to market power-efficient, highly targeted platforms, the VIA NAB 7500 brings VIA’s expertise to the network appliance sector.

Designed to address the needs of today’s modern network security systems, the feature-packed VIA NAB 7500 is a highly integrated Network Appliance Board for network security or gateway applications, including Firewall, VPN, UTM, Anti-Virus and Intrusion Prevention System products. Other network applications include Proxy Server, Quality of Service and Load Balancer products.

To meet the demand for high performance, reliable and secure networks, the VIA NAB 7500 features five Gigabit Ethernet ports (4 of which through PCI Express) supporting LAN Bypass, a USB WLAN interface, four S-ATA ports for data logging or signature, serial ports for console redirection with an LCM power function, plus several other features for added reliability and security, including a TPM module for hardware-based data protection, all powered by a low heat, energy-efficient VIA C7 processor.

“VIA is proud to bring to market a product specifically designed to accurately meet the needs of network system integrators” said Daniel Wu, Assistant Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Being designed specifically for this sector, the NAB7500 offers superb networking performance without compromising on power-efficiency or security”

About the VIA NAB 7500 Board
Powered by an energy-efficient 1.5GHz VIA C7 processor (with other speed options available for project customers) and the versatile VIA CN896 chipset, the VIA NAB 7500 supports up to 3.5GB of DDR2 system memory, 4 Gigabit Ethernet ports on a high bandwidth PCI-e bus with an additional Gigabit LAN port on the PCI bus. The VIA NAB 7500 also supports a LAN Bypass feature for added protection from system hang-up and power failure, with control available through the Watch Dog Timer, GPIO or custom developed software.

System expandability is provided through a Golden Finger expansion module for discreet system expansion in a multi-board configuration or the addition of up to 3 PCI Cards. Data storage is simple with 4 S-ATA ports supporting RAID 0 and RAID 1, as well as a 44-pin IDE/Compact Flash socket. With an optional TPM chip for superior software and content security, a COM port, 8 GPIO ports, pin headers for PS/2 and VGA ports, LAN and LAN Bypass front panel LEDs and up to 6 USB 2.0 ports, the VIA NAB7500 offers tremendous design flexibility.

Security can be augmented by enabling the VIA PadLock™ Security Engine, a hardware based security technology that provides the latest military-grade encryption and protection with the world’s fastest x86 security engine. VIA StrongBox is an application that uses the power of the VIA PadLock Security Engine allowing users to create up to 10 encrypted virtual drives.

Full specifications of the VIA NAB 7500 may be found on the VIA website at:
http://www.via.com.tw/en/products/mainboards/motherboards.jsp?motherboard_id=570

VIA NAB 7500 Pricing and Availability
Pre-release samples are available now to project-based customers. For more details and pricing, please contact your local VIA sales representative or send an email to: embedded@via.com.tw

About VIA Technologies, Inc.
VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs, motherboard vendors and system integrators. www.via.com.tw.

Sunnyvale, CA—January 17, 2008—OCZ Technology Group, Inc., a worldwide leader in innovative ultra-high performance and high reliability memory, today announced the PC2-8000 Platinum Edition 4GB dual channel kit, designed to boost the performance of mainstream gaming systems. These new 2GB modules are the ultimate upgrade for entry-level enthusiasts seeking an exceptional overclocking kit at a price point that suits all budgets.

As part of OCZ’s Platinum series, the PC2-8000 2GB modules are engineered to satisfy the demands of overclockers and enthusiasts, and designed to deliver the performance and speed gamers require for today’s graphic-intensive DirectX 10 PC games. At a blistering 1000MHz, the 4GB Platinum Edition runs at faster speeds than typical 2GB modules, offering incredible bandwidth and stability on the latest platforms.

For 64-bit Vista™ users who need the performance of high speed memory, the PC2-8000 Platinum 4GB kit is the ideal upgrade from the standard 2GB of RAM. The OCZ PC-8000 Platinum series was developed to provide a superior computing experience that ensures the best possible gaming and productivity while maintaining excellent value for enthusiast upgrades.

“System memory density is a significant cost factor in the overall configuration of any personal computer,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “However, retrofitting a system with an abundance of memory does not necessarily translate into having to spend an abundance of cash. By releasing quality products like the PC2-8000 2GB modules at a low price point, OCZ Technology once again demonstrates the commitment to providing the customers with the best possible solution in the market place.”

The PC2-8000 Platinum 4GB Edition memory will be available in 2048MB (2GB) modules and 4GB dual channel kits with an MSRP of $159.99 USD. All modules are 100% hand-tested for quality assurance and compatibility and feature high quality, platinum-mirrored XTC (Xtreme Thermal Convection) heatspreaders for the most effective heat dissipation. Furthermore, each OCZ Platinum Edition memory module is backed by the industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.

For more information on the DDR2 PC2-8000 Platinum 4GB Edition, please visit our product page here.

About OCZ Technology Group, Inc.
OCZ Technology Group, a member of JEDEC, designs, develops and manufactures ground-breaking, high performance memory and computer components that set industry standards. OCZ products are the first choice for users needing high-reliability, ultra-high performance solutions. In 2007, PC Power & Cooling and Hypersonic PC were brought into the OCZ Technology Group, forming a well-rounded, highly innovative organization that places the company at the forefront of high-end computing. All of OCZ Technology Group’s products are available through its worldwide network of distributors, online resellers and retail stores. For more information visit our website at www.ocztechnology.com.

CES 2008—Las Vegas, Nevada—January 11, 2008—OCZ Technology Group, Inc. (LSE: OCZ), a worldwide leader in innovative, ultra-high performance and high reliability memory, computer components, and systems, today unveiled a number of ground-breaking, next generation products at the 2008 Consumer Electronics Show. With last year’s acquisition of Hypersonic PC and PC Power & Cooling, two cutting edge providers of high-end computing products, OCZ will have a wealth of new solutions covering the entire span of the enthusiast industry, from high performance hardware to complete desktop and laptop systems.

OCZ Technology
As the leader in high performance memory, OCZ is showcasing ultra-high speed DDR3 solutions designed for the extreme enthusiast. The latest Flex archetype, “Flex2,” offers the most efficient thermal management through the optimal balance of liquid and air cooling for high performance memory modules.

Expanding into water cooling accessories, OCZ developed the HydroFlow CPU waterblock unit to cool the most powerful processors paired with any liquid cooling set-up. The HydroFlow was designed with the highest possible exchange rate between the block and the coolant with the unique triangular fin design, and is the preeminent way to efficient cooling for overclocked CPUs. The Flex2 and HydroFlow will be debuted together for water-cooling fanatics.

In 2008, OCZ intends to make mobile storage more accessible than ever with the speedy Rally2 and ultra-durable ATV flash drives now available in incredible 32GB capacities. Additionally, OCZ is introducing the all-new Rally2 Turbo, an even faster version of the highly awarded Rally2. With a never-ending quest to revolutionize new markets, OCZ will also introduce its new high-capacity SATA and SATAII Solid State Drives offering consumers more power efficient alternative to standard hard disc drives for laptops.

OCZ brings the powerful new EliteXStream 1000W to the system-builder and enthusiast market. With 1 Kilowatt of raw power, high efficiency (82%) rating and trend-setting single +12V Rail (80A), this PSU will provide optimum power distribution, all within a standard ATX form factor that easily fits most cases.

OCZ is showcasing the latest edition of the NIA (Neural Impulse Actuator), an innovative input device that takes the next step towards a full integration of central and peripheral nerve activity into controlling personal computers. The Neural Impulse Actuator will be shown in gaming demos, and now features a USB connection and enhanced user software.

PC Power & Cooling
The legendary Silencer Quad 750 will be showcased in a new blue version to add extra style to gaming systems, along with the original red and black models. Also new in the lineup is the Silencer 500W EPS for mainstream enthusiast systems. The recently released Turbo-Cool 860W will be accessible for enthusiasts to experience the convenience of its adjustable rail design. A Hypersonic desktop system will be demoed featuring new Turbo-Cool 1200, featuring the revolutionary Enthusiast System Architecture (ESA) providing a real first-look at this innovation.

Hypersonic PC
OCZ Group announces a new gaming laptop series, Aero by Hypersonic. The ultra-thin and feature-rich Aero AR5 15.4” and AR7 17” notebooks are designed for performance and ultimate portability.

Adding the excitement of CES, Hypersonic will be showcasing new Intel® mobile and desktop processor technology. Partnering with Intel to maximize mobility, Hypersonic will be one of the few exhibiting the new Santa Rosa Refresh mobile platform featuring 45nm Hi-k Intel Core™2 Duo mobile processor for Centrino®. You can find these notebooks at the Intel booth in Central Hall #7153 and at the OCZ exhibition suite.

With a diversified offering of innovative products from OCZ, PC Power & Cooling, and Hypersonic PC, the OCZ Technology Group aims make its mark on this year’s CES and set the pace for a year in true innovation.

About OCZ Technology Group, Inc.
OCZ Technology Group, a member of JEDEC, designs, develops and manufactures ground-breaking, high performance memory and computer components that set industry standards. OCZ products are the first choice for users needing high-reliability, ultra-high performance solutions. In 2007, PC Power & Cooling and Hypersonic PC were brought into the OCZ Technology Group, forming a well-rounded, highly innovative organization that places the company at the forefront of high-end computing. All of OCZ Technology Group’s products are available through its worldwide network of distributors, online resellers and retail stores. For more information visit our website at www.ocztechnology.com.

About PC Power & Cooling
Over the last 22 years, PC Power & Cooling has produced many innovative computer products including: the first CPU cooler, the first PC heat alarm, the first independently-regulated PC power supply, the first redundant power system, the first NVIDIA® SLI™ certified supply, the first One Kilowatt computer power supply, and the first power supply with its own certified test report (Turbo-Cool 1KW). In May 2007, PC Power & Cooling was brought into the OCZ Technology Group, forming a partnership that places the combined organization at the forefront of the high-performance computing industry. For more information visit the PC Power & Cooling website at www.pcpower.com.

About Hypersonic PC
Hypersonic PC Systems is a leader in providing cutting edge technology to the most astute and selective users in the PC market. With world-renowned commitment to service and support, Hypersonic has been paving the way in high performance computing since 1996. Hypersonic offers customers more than just high-end computer systems. We offer them quality, craftsmanship, world-class support and personal attention, and it is these elements that have resulted in numerous industry awards and recognition. In October 2007, Hypersonic was brought into the OCZ Technology Group, representing the system division. For more information visit our website at www.hypersonic-pc.com.

Two PCI-Express 2.0-Slots for two graphics cards

Ideal for the latest Intel 45nm processors

“Gamers appreciate the high frame rates with two graphics cards and professional users enjoy the benefit of up to four monitors“, explained Tom Seiffert, Head of Marketing & PR at Shuttle Computer Handels GmbH. “Together with Intel Core 2 Quad CPUs with four cores and up to 8 GB DDR2 memories, this Mini-PC can achieve extremely fast speeds.”

The Intel X38 Express chipset with PCI-Express 2.0 provides broadband up to 16 GB/s, twice as much as in PCI-Express 1.0. This also provides huge potential for future graphics cards.

The XPC Barebone SX38P2 Pro also has space for up to three internal hard disks and two external eSATA drives can be connected at the back. The Gigabit network interface ensures good, high-speed connections.

The realistic 8-Channel HD-Sound is secured by the Dolby® Digital Live! and the DTS[TM] Connect certification. The audio signal can be transferred lossless by SPDIF optically or electrically. A Mini-PCIe-Slot is used for the Intel Turbo Memory and thereby accelerates the system start and frequent program start-ups.

Shuttle XPC Barebone SX38P2 Pro (Prima Series):

• Intel® X38 Express / ICH9R chipset
• Supports 45nm processors and/or current models of the Intel® Core[TM] 2 Extreme / Core[TM] 2 Quad / Core[TM] 2 Duo Series with Socket 775 (up to FSB 1333)
• Max. 8 GB Dual Channel DDR2-800 (OC up to 1066 MHz)
• 8-Channel HD-Audio with Dolby® Digital Live! and DTS[TM] Connect
• 2x PCI-E 2.0 X16 (ATI CrossFire[TM]), 1x Mini-PCIe
• Gigabit LAN
• 2x FireWire, 8x USB 2.0
• 4x SATA2, 2x eSATA
• USB Speed-Link
• Fingerprint Scanner
• 450 watt power supply (80 PLUS)
• 325(D) x 220(W) x 210(H) mm

The Shuttle XPC Barebone SX38P2 Pro is available now in specialist stores. Shuttle’s recommended price is EUR 429 (excluding VAT).

About Shuttle:
Shuttle Inc., the market leader in the Mini-PC sector and manufacturer of Multi-Form-Factor solutions, is now launching its first Mini-PC-Barebone designed for 45nm Intel processors and which can accommodate two graphics cards. Also available for the XPC Barebone SX38P2 Pro is a highly-efficient 450 watt power supply with 80 PLUS certification. This enables the two PCI-Express graphics cards and the fastest processors to run smoothly. www.shuttle.com.